Several months ago we talked about ball grid arrays (BGAs) and their relationship to thermal stress problems.

If you understand how ball grid arrays work, it opens up the possibility of inexpensive repair strategies for things like graphics cards that have been damaged by thermal stress. It falls into the category of a “if you have nothing to lose…” strategy, but it’s a possibility:

The essence of this idea: bake your graphics card in your oven (200 degrees C or 400 degrees F) to remelt the solder in the ball grid array in the hope that it fixes cracked solder joints. If you have nothing to lose, it can’t hurt to try it.

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